Our solution enables high-speed, high-precision inspection of large-area battery module case U-frames, scanning all 10 surfaces with ultra-high-resolution (300MP) imaging to detect microscopic defects—including burrs, scratches, dents, and deformations—with 200μm accuracy. To handle narrow and elongated fields of view, the system employs advanced stitching technology for seamless image preprocessing, while deep learning-based segmentation allows for the detection of defects as small as 7 pixels. 

To further optimize performance, CUDA Stream technology accelerates model inference, and the system supports automated pass/fail classification based on defect size specifications, ensuring seamless real-time quality control. With a 12-second cycle time, this solution is ideal for high-volume manufacturing, delivering both exceptional speed and accuracy. 

For dimensional inspection, the system utilizes a high-speed, non-contact 3D sensor to precisely measure flatness, edge contours, width, and thickness with sub-micron precision. It significantly reduces tact time from 25 minutes (traditional CMM systems) to just 12 seconds, while achieving ±15μm mechanical repeatability and 1 sigma accuracy within 10μm compared to CMM measurements. By eliminating physical contact, this method prevents sample damage, ensuring fast, safe, and highly reliable quality control, while maximizing production efficiency and measurement accuracy.